Semiconductor Processing
Working closely with leading manufacturers of semiconductors the expertise of MTC Rugby engineers has led to innovative solutions for some of the most challenging problems faced in the Silicon chip manufacturing industry.
We utilise the extensive knowledge and expertise of our engineers to manufacture ceramic, ceramic-to-metal assemblies and also metallised ceramic components for use within semiconductor production. It is through a dedication to providing supportive customer service throughout the manufacturing process and wholly understanding the needs of chip manufacturers that we are able to provide innovative solutions to the demands of the semiconductor industry.
MTC Rugby materials offer excellent corrosion resistance and mechanical strength, exceptional electrical insulation combined with very good surface finish. These properties are essential for end-effectors designed to handle 300 and 450mm wafers. Due to the mechanical strength of our materials, we are able to offer a better strength to thickness ratio than conventional metal.
Corrosive chemicals used in Silicon wafer production demand excellent corrosive properties. Our deposition chambers with an OD in excess of 510mm and 500mm long and isolating rings in excess of 510mm will meet industry specifications.
Our materials formulation has been designed for our ceramic components to be thick film or thin film coated (PVD sputtering technique).
Working closely with original equipment manufacturers (OEMs) to develop valuable and productive partnerships, the ceramic components manufactured at the MTC Rugby facility meet the bespoke requirements of clients and range in quantity from prototypes through to medium and high volume production.
Typical Materials:
- Alumina
- Ceramic/Metal Assemblies
Typical Applications:
- Heater Assemblies
- Lift Pins
- Wafer Clamps
- End Effectors
- Paddles
- Chamber Rings
- Ion Implantation
- Power Supplies
- ESC Components
- Deposition Chambers
